* Micro-semiconductor
The structure of (active, passive, odd-form and interconnect) microelectronic and opto-electronic devices; Radiation hardened microelectronic components in the satellite, spacecraft and space electronic manufacturing technologies.
* Electronic Manufacturing
SMT (Design for Manufacture, Process Control, Solder Materials, Printing, Adhesives and Dispensing, Component Placement and Soldering) and SMT line machineries (printer, turret-style chip-shooter, pick-and-place and vision systems); Electro-luminescent technologies, particularly EL displays and their application in wireless systems and portable multifunction equipments.
* Vision Technology
Application of machine visions for industrial inspection (particularly, advanced AOI and XRV Vision/X-ray inspection machines for defect detection and statistical analysis in the SMT line), medical images as well as remote sensing.
* Test and Measurement
The structure and function of basic and specialized test instruments (counters, timers, power supplies, logic analyzers, meters, analog and digital oscilloscopes, spectrum analyzers and signal generators); Test and handling of micro-electronic chips; In-circuit test equipments; Protocol-independent test strategy for wireless (GSM, CDMA and TDMA) technologies; In-process functional test of basic parameters (power, frequency, phase and voltage) of RF-component in wireless technologies for OEMs/CEMs with mass production; The strategy of automation and industrial standardization for defect prevention and process improvement for boosting yield; Tribological tests (scanning electron microscopy, micro-photography, topography and image processing).
* Nuclear technologies
Basis of nuclear technology in nuclear fission and fusion reactions; “Nuclear data” (constants, structures, decays and reactions); Uranium enrichment, gaseous diffusion, centrifuge process, and laser enrichment processes in the third-generation nuclear technology; Radiation technology and radiation dosimetry in crystals, semiconductors and electronic components (applied in satellite and spacecraft industries).
* Metrology and Calibration
Test equipment management, non-contact metrology system and calibration program requirements; calibration laboratories utilizing intrinsic standards and recalibration interval; electro-optical metrology equipment and spectroscopy; and metrology data (calibration procedures, technical manuals for test and inspection equipment, engineering information on calibration laboratories).
* Synthetic Fiber
Covered synthetic fiber processing (core breaks, failure phenomena, dynamics of hollow spindles, air circulation and balloon formation in synthetic and natural yarn processing). |
